ABOUT US


Mini Micro Stencil, Inc. is the Industry leader in the design and development of stencil tools, equipment, and processes for rework, repair of SMT/BGA and electronic components.  Mini Micro Stencil has been instrumental in changing the way SMT rework is viewd and what can be done in-house.  With a full array of rework stencils, tools for re-balling and solder paste printing applications we want to help operators take control of their rework needs. 

We are a team of fully capable and experienced techinicians working to lead the industry through innovation.

 

OUR PRODUCTS


STENCILS

FLIP UP | CPF | RE-BALL SCREEN | FLAT PLATE STENCIL | XRAY

BGA-REBALLING KITS

ACCESSORIES

MM-1 MINI MIRROR| SH-1 STENCIL HANDLE | SQUEEGEE BLADES | SOLDER BALLS | CPF CLAMPS

OUR SERVICES


  • SMT/BGA REMOVAL
  • SMT/BGA PLACEMENT 
  • BGA RE-BALLING 
  • X-RAY AND OPTICAL INSPECTION 
  • BAKING AND SEALING  

Our 25+ years of experience results in consistent, reliable and high quality rework in all aspects of BGA | QFN rework, re-balling and X-Ray Inspection.