CPF

COMPONENT PRINT FRAME

CPF Process

The CPF (Component Print Frame) was designed to ensure accurate solder paste deposition onto the balls of the BGA. Because the CPF prints paste onto the BGA, there are no keep out or clearance issues with adjacent component on the PCB.

For more information and pricing contact us.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Contact us anytime with questions, comments or just to get more info

Mini Micro Stencil, Inc.
1165 Linda Vista Dr., Suite 107, San Marcos, CA 92078
Telephone 888.456.4823 and 760.591.3804 l Fax 760.591.0853

 

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