Allows
the operator to inspect the solder joints of BGA
components before and after the rework-reflow
process.
The
photos below show that the wide field of view of
the Mini Mirror permits outstanding images as
compared to other tools that are on the market at
over 5 times the Mini Mirror price.
Mini
Mirror Inspection Tool
Mini
Micro Stencil announces the introduction of the new
Mini Mirror inspection tool. The new Mini Mirror
allows the user to be able to inspect solder joints
of a BGA component before and after the reflow /
rework process. This will permit the operator to be
able to visually inspect the outer row of solder
spheres to determine proper wetting of the solder
joint.
The flexibility of
the tool allows the user to be able to change the
angle of the Mini Mirror so that the solder sphere
connection to the package as well as the PCB can be
seen.
The Mini Mirror's
field of view is .700 inches wide. When you consider
that all of these advantages are available at this
price, the Mini Mirror is clearly without equal.
Keep in mind that when it comes to visual inspection
. . . SIZE COUNTS.
