Outsource your Reballing Needs:

  • Reattachment of solder spheres
  • Convection and conduction reflow
  • Complete Turnkey service
  • ESD workstations
  • Professional staff with over 20 years experience

For more information or
quotes please contact us.

* Lead Time and pricing
available on request.

BGA Reballing Services

Reballing Services
Mini Micro Stencil offers reballing services for your CBGA, PBGA, and TBGA. Featuring the RB-2000 for the application of solder spheres to your component.

Reflow for the reattachment of solder spheres is done on a Sikama hot plate belt oven or APS GF-12.

Contact us anytime with questions, comments or just to get more info

Mini Micro Stencil, Inc.
1165 Linda Vista Dr., Suite 107, San Marcos, CA 92078
Telephone 888.456.4823 and 760.591.3804 l Fax 760.591.0853

 

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