SMT/BGA REMOVAL

  • Site Preparation
  • Pad Repair
  • Trace Repair

SMT/BGA PLACEMENT

  • lead-free capabilities
  • Precise optical alignment
  • Accurate monitored profiles
  • Prototype Builds

BGA RE-BALLING

  • Lead to lead
  • Lead-free to lead
  • Lead to lead-free
  • Component Recovery

XRAY & OPTICAL INSPECTION

  • 100% X-ray inspection
  • Endoscopic perimeter inspections

BAKING & SEALING

  • Drive out damaging moisture
  • Sealed in moisture barrier bags with desiccant

Services

BGA ReworkXray Inspection

 

Mini Micro Stencil, Inc. has been providing quality low cost rework service for years and was one of the first contract rework-only shops in the industry. We are equipped with several high caliber BGA Rework machines providing us with the ability to perform our services at the highest peak of excellence. With our extensive rework knowledge we can quickly create working profiles, at no extra charge, to help get your product out the door as fast as possible. Manufacturing our own stencils also allows us rework lead times faster than the industry standard and with a vast array of in-stock stencils, we can prevent tooling charges from being passed on to the customer. Mini Micro Stencil, Inc. combines low prices with a quality quick turn service, making us the solution to all your rework needs.

 

We offer a seemingly endless variety of lead and lead free rework services including BGA, QFN & QFPP removal, replacement; BGA reballing; X-ray inspection service; endoscope inspection; pad replacement; trace/jumper wire replacement or repair; masking touch-up on repaired or damaged traces; PCB & component baking for moisture prevention; vacuum sealing; etc.

 

You can rely on Mini Micro Stencil’s dedication, innovation and experience to come up with real rework solutions for your most challenging needs.

 




SERVICE DEPT

E: services@minimicrostencil.com

T: 760.471.8458  

F: 760.591.0853


X-Ray Services

X-ray service is done with a high powered machine at a low shop rate.  All boards worked at Mini Micro Stencil are both x-rayed and given a side view inspection to ensure a solid solder connection each time.  Every customer will recieve their own X-ray image copy at the time of completion