The CPF (Component Print Frame) was designed to ensure accurate solder paste deposition onto the balls of the BGA. Because the CPF prints paste directly onto the component, there are no keep out or clearance issues with adjacent components on the PCB.
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CFP/COMPONENT PRINT FRAME STENCIL
This is the New CPF-100 from Mini Micro Stencil. This tool allows the end user to be able to print solder paste onto a component, then present the tool to the rework station for pick-up and placement of the component.