PRODUCTS

FLIP UP/PCB PRINT STENCIL

Designed to be used with SH-1 Handle and many different rework stations.  The Flip-Up Stencil has been designed to apply solder paste to the PCB pads for BGA, QFP, PLCC, SOIC, and connector patterns.

FLAT PLATE STENCIL

Mini Micro stencil offers a flat plate stencil option that will allow the technician to place the stencil flat onto the site on the PCB without the use of additional tooling. In most cases the technician will use kapton tape to hold one side of the stencil plate down.   After the solder paste has been applied, the technician can lift the other side of the stencil up. Flat plates include the option to fold one edge for ease in removal.  All flat plate stencils are made from stainless steel, ensuring the longest product life possible.

SH-1

Hand held stencil printing tool. Designed to be used with the Mini Micro Stencil Flip up stencils

CPF/COMPONENT PRINT STENCIL

The CPF (Component Print Frame) was designed to ensure accurate solder paste deposition onto the balls of the BGA.  Because the CPF prints paste directly onto the component, there are no keep out or clearance issues with adjacent components on the PCB.

REBALL KIT RB-2000

 RB-2000 Vacuum Base Solder Spheres Reballing Screen (pattern Specific) Flux Brush & Dispensing Brush Component tray

SQUEEGEE BLADES

Used to apply solder paste, with a CPF of Flip up stencil. Carry array of sizes (5 pack). Stock Squeegee Blade Size Chart (sizes in inches) 0.200 0.300 0.400 0.500 0.600 0.650 0.7500 0.780 0.900 0.910 0.950 1.000 1.080 1.175 1.250 1.350 1.450 1.500 1.600 1.650 1.700 1.750 1.900 2.000 2.300

REBALL SCREEN

Mini Micro Stencil offers a wide variety of screens for the re-application of solder spheres to the BGA component. These screens are made from stainless steel and will give the end user many years of use. Mini Micro Stencil offers a “body capture” option that will allow the screen to use the perimeter of the component to help align the screen and hold it into position while the technician is re-working the component. This will increase production output, quality and reduce cleaning unlike other available processes. 

MINI MIRROR INSPECTION TOOL

The Mini Mirror inspection tool allows the use to inspect solder joints of a BGA component before and after the reflow/rework process. This will permit the operator to visually inspect the outer row of solder spheres to properly wet the solder point. The flexibility of the tool allows the user to change the angle of the Mini Mirror so that the solder sphere connection to the package, as well as the PCB, can be seen. Mini Micro Stencil offers 2 different sizes The MM1-70 has a .70 field of view and the NEW MM1-30 offers a .30 field of view which will allow you to get into smaller areas.

SOLDER BALLS

Mini Micro Stencil offers a wide range of common size solder balls in both lead and lead free. We can offer these to the end user in quantity's starting at 5,000. Please contact our sales department for price and availability.

MAIN

T : (760) 591.3804

F : (760) 591.0853

E : sales@minimicrostencil.com

SERVICE DEPT

T : (760) 471.8458  

F : (760) 591.0853

E : services@minimicrostencil.com

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