• Site Preparation

  • Pad Repair

  • Trace Repair

  • Lead-free capabilities

  • Precise optical alignment

  • Accurate monitored profiles

  • Prototype Builds

  • Lead to lead

  • Lead-free to lead

  • Lead to lead-free

  • Component Recovery

  • 100% X-ray inspection

  • Endoscopic perimeter inspections

  • Drive out damaging moisture

  • Sealed in moisture barrier bags with desiccant

Mini Micro Stencil, Inc. has been providing quality low cost rework service for years and was one of the first contract rework-only shops in the industry. We are equipped with several high caliber BGA Rework machines providing us with the ability to perform our services at the highest peak of excellence. With our extensive rework knowledge we can quickly create working profiles, at no extra charge, to help get your product out the door as fast as possible. Manufacturing our own stencils also allows us rework lead times faster than the industry standard and with a vast array of in-stock stencils, we can prevent tooling charges from being passed on to the customer. Mini Micro Stencil, Inc. combines low prices with a quality quick turn service, making us the solution to all your rework needs.


We offer a seemingly endless variety of lead and lead free rework services including BGA, QFN & QFPP removal, replacement; BGA reballing; X-ray inspection service; endoscope inspection; pad replacement; trace/jumper wire replacement or repair; masking touch-up on repaired or damaged traces; PCB & component baking for moisture prevention; vacuum sealing; etc.


You can rely on Mini Micro Stencil’s dedication, innovation and experience to come up with real rework solutions for your most challenging needs.