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Mini Micro Stencil offers a wide variety of screens for the re-application of solder spheres to the BGA component.

These screens are made from stainless steel and will give the end user many years of use. Mini Micro Stencil offers a “body capture” option that will allow the screen to use the perimeter of the component to help align the screen and hold it into position while the technician is re-working the component. This will increase production output, quality and reduce cleaning unlike other available processes.

Please contact us for more information!

REBALL SCREEN

REBALLING MADE EASY!

Step 1

Apply a thin layer of tacky flux evenly to a clean component
Place BGA on Component Tray
Place Trafy onto Vaccuum Base (vaccuum will hold the parts)
Place & Align reball screen onto component (Flux will hold screen in place)

Mini Micro Stencil - BGA Reballing Servi

Step 2

The part is now prepared for application of solder spheres

Mini Micro Stencil - BGA Reballing Servi

Step 3

Pour solder spheres onto reball screen

Mini Micro Stencil - BGA Reballing Servi

Step 4

Brush of excess solder spheres into vacuum tray

Mini Micro Stencil - BGA Reballing Servi

Step 5

Carefully remove tray (with component and screen) from base
Reflow - Remove screen after the part has cooled

Mini Micro Stencil - BGA Reballing Servi

Step 6

REBALLED BGA - READY TO GO!

Mini Micro Stencil - BGA Reballing Servi