MAIN

T : (760) 591.3804

F : (760) 591.0853

E : sales@minimicrostencil.com

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SERVICE DEPT

T : (760) 471.8458  

F : (760) 591.0853

E : services@minimicrostencil.com

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©2019 Mini Micro Stencil, Inc.

Mini Micro Stencil offers a wide variety of screens for the re-application of solder spheres to the BGA component.

 

These screens are made from stainless steel and will give the end user many years of use. Mini Micro Stencil offers a “body capture” option that will allow the screen to use the perimeter of the component to help align the screen and hold it into position while the technician is re-working the component. This will increase production output, quality and reduce cleaning unlike other available processes. 

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Please contact us for more information!

REBALL SCREEN

REBALLING MADE EASY!
Mini Micro Stencil - BGA Reballing Servi
Step 1

  • Apply a thin layer of tacky flux evenly to a clean component

  • Place BGA on Component Tray

  • Place Trafy onto Vaccuum Base (vaccuum will hold the parts) 

  • Place & Align reball screen onto component (Flux will hold screen in place) 

Mini Micro Stencil - BGA Reballing Servi
Step 2

  • The part is now prepared for application of solder spheres

Mini Micro Stencil - BGA Reballing Servi
Step 3

  • Pour solder spheres onto reball screen

Mini Micro Stencil - BGA Reballing Servi
Step 4

  • Brush of excess solder spheres into vacuum tray

Mini Micro Stencil - BGA Reballing Servi
Step 5

  • Carefully remove tray (with component and screen) from base

  • Reflow - Remove screen after the part has cooled

Mini Micro Stencil - BGA Reballing Servi
Step 6

  • REBALLED BGA - READY TO GO!