CONTRACT REWORK SERVICES
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SMT/BGA REMOVAL
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SMT/BGA PLACEMENT
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BGA RE-BALLING
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X-RAY INSPECTION
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BAKING & SEALING
INDUSTRIES SERVED:
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Aerospace
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Medical
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Commercial Electronics
Our 25+ years of experience results in consistent, reliable and high quality rework in all aspects of BGA | QFN rework, re-balling and X-Ray Inspection.
PRODUCTS
STENCILS/TOOLS:
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FLIP UP
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CPF
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RE-BALL SCREEN
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FLAT PLATE STENCIL
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BGA-REBALLING KITS
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MM-1 MINI MIRROR
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SH-1 STENCIL HANDLE
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SQUEEGEE BLADES
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SOLDER BALLS
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CPF CLAMPS
SERVICES
ABOUT US
Mini Micro Stencil, Inc. is the Industry leader in the design and development of stencil tools, equipment, and processes for rework, repair of SMT/BGA and electronic components. Mini Micro Stencil has been instrumental in changing the way SMT rework is viewed and what can be done in-house. With a full array of rework stencils, tools for re-balling and solder paste printing applications we want to help operators take control of their rework needs.
We are a team of fully capable and experienced technicians working to lead the industry through innovation.
