(760) 591.3804
CONTRACT REWORK SERVICES
Mini Micro Stencil Provides Contract Rework Services for Transportation, Aerospace, Medical, Commercial Electronics, and More!
Mini Micro Stencil, Inc. has been providing quality low-cost rework service for years and was one of the first contract rework-only shops in the industry. We are equipped with several high-caliber BGA Rework machines providing us with the ability to perform our services at the highest peak of excellence. With our extensive rework knowledge, we can quickly create working profiles, at no extra charge, to help get your product out the door as fast as possible. Manufacturing our own stencils also allows us rework lead times faster than the industry standard and with a vast array of in-stock stencils, we can prevent tooling charges from being passed on to the customer.
Mini Micro Stencil, Inc. combines low prices with a quality quick-turn service, making us the solution to all your rework needs.
We offer a seemingly endless variety of lead and lead-free rework services including BGA, QFN & QFPP removal, replacement; BGA reballing; X-ray inspection service; endoscope inspection; pad replacement; trace/jumper wire replacement or repair; masking touch-up on repaired or damaged traces; PCB & component baking for moisture prevention; vacuum sealing; etc.
You can rely on Mini Micro Stencil’s dedication, innovation, and experience to come up with real rework solutions for your most challenging needs.
SMT/BGA REMOVAL
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Site Preparation
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Pad Repair
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Trace Repair
Mini Micro Stencil's SMT/BGA removal services offer precise and efficient solutions for extracting Surface Mount Technology (SMT) or Ball Grid Array (BGA) components from printed circuit boards (PCBs). Utilizing advanced techniques and equipment, these services carefully heat the solder joints to safely remove components without damaging surrounding elements or the PCB itself. This facilitates repairs, upgrades, or replacements of faulty components, ensuring the integrity and functionality of electronic devices.
SMT/BGA PLACEMENT
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Lead-free capabilities
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Precise optical alignment
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Accurate monitored profiles
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Prototype Builds
Our SMT/BGA placement services provide accurate and efficient assembly solutions for Surface Mount Technology (SMT) and Ball Grid Array (BGA) components on printed circuit boards (PCBs). Utilizing advanced machinery and expertise, these services ensure precise placement of components, enabling high-density connections and enhancing the reliability and performance of electronic devices.
BGA REBALLING
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Lead to lead
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Lead-free to lead
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Lead to lead-free
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Component Recovery
Our BGA reballing services offer precise solutions for restoring or replacing solder balls on Ball Grid Array (BGA) components. Utilizing advanced techniques and equipment, these services remove old solder balls, clean the surface, and apply new solder balls, ensuring optimal connectivity and functionality. This process is essential for repairing or refurbishing electronic components, maintaining the integrity and reliability of electronic devices.
X-RAY OPTICAL INSPECTION
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100% X-ray inspection
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Endoscopic perimeter inspections
Our X-ray optical inspection services utilize advanced technology to examine and assess the quality and integrity of miniature components and solder joints on printed circuit boards (PCBs). This thorough inspection process ensures precise and reliable assembly, identifying any defects or irregularities that may affect performance or reliability.
BAKING
& SEALING
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Drive out damaging moisture
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Sealed in moisture barrier bags with desiccant
Mini Micro Stencil's baking and sealing services ensure the optimal performance and longevity of precision stencils used in electronics manufacturing. Through controlled baking processes, moisture is removed from the stencil material, preventing warping or degradation. Additionally, sealing techniques protect stencils from environmental factors, maintaining their integrity during storage and use, ultimately enhancing the quality and consistency of solder paste application.
We are a team of fully capable and experienced technicians working to lead the industry through innovation.
Located in San Diego, CA, servicing Nationwide
Mini Micro Stencil, Inc. is the Industry leader in the design and development of stencil tools, equipment, and processes for rework, repair of SMT/BGA and electronic components. Mini Micro Stencil has been instrumental in changing the way SMT rework is viewed and what can be done in-house. With a full array of rework stencils, tools for re-balling and solder paste printing applications we want to help operators take control of their rework needs.
REWORK TOOLS FOR SALE
NEW REWORK STARTER KIT RSK-21
