Regular Price $69, Your Price $59*
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The Mini Mirror inspection tool allows the user to inspect solder joints of a BGA component before and after the reflow/rework process. This will permit the operator to visually inspect the outer row of solder spheres to properly wet the solder point.
1- .70” mirror
1- .30” mirror
BAKING & SEALING
Our 25+ years of experience results in consistent, reliable and high quality rework in all aspects of BGA | QFN rework, re-balling and X-Ray Inspection.
Mini Micro Stencil, Inc. is the Industry leader in the design and development of stencil tools, equipment, and processes for rework, repair of SMT/BGA and electronic components. Mini Micro Stencil has been instrumental in changing the way SMT rework is viewed and what can be done in-house. With a full array of rework stencils, tools for re-balling and solder paste printing applications we want to help operators take control of their rework needs.
We are a team of fully capable and experienced technicians working to lead the industry through innovation.